双面多层电路板
高登威德电子可以生产的PCB为1-16层，铜厚为1-12oz, 请参考以下我们的PCB规格参数：
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Item
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Specification
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Remarks
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Number of Layer
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1-14 layers
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Material
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CEM-3,FR-4
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High Tg CCL Is Available
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Finish Board Thickness
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0.2mm-3.20mm
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( 8mil-126mil)
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Minimun Core Thickness
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0.075mm(3mil)
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Copper Thickness
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1/2 oz min; 3 oz max
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Min.Trace Width & Line Spacing
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0.075mm/0.1mm(3mil/4mil)
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Min.Hole Diameter for CNC Driling
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0.25mm(12mil)
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Min.Hole Diameter for Punching
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0.9mm(35mil)
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Biggest Pabek Sise
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700mm×510mm
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Dunebsuib
Tikerabce |
Hole Positon
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+/-0.075mm(3mil) CNC Driling
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Conductor Width(W)
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+/-0.05mm(2mil)or
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+/-20% of original artwork
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Hole Diameter(H)
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PTH L:+/-0.075mm(3mil)
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Non-PTH L:+/-0.05mm(2mil)
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Outline Tolerance
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+/-0.125mm(5mil) CNC Routing
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+/-0.15mm(6mil) by Punching
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Warp & Twist
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0.7%
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Insulation Resistance
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＜50ohm
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Test Voltage
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300V
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V-Cutting
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Panel Size
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110×100mm(min)
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Jump Score Is Available
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660×600mm(max)
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Multilayers
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Layer-layer misregistration
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4 layers:0.15mm(6mil)max
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6 layers:0.25mm(10mil)max
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Min.spacing between hole edge to circuity pqttern of an inner layer
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0.25mm(10mil)
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Min.spacing between board oulineto circuitry pattern of an inner layer
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0.25mm(10mil)
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Board thickness tolerance
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4 layers:+/-0.13mm(5mil)
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6 layers:+/-0.15mm(6mil)
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Impedance Control
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20-75 ohm+/-10%
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Different Impendance
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75-150 ohm+/-10%
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Finish Board Surface
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HASL,OSP,Au /agimmersion,Au Plating Etc
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电路板工艺流程：
