what is PCB Assembly-PCB assembly PCBA manufacturer,printed circuit board assembly
PCB assembly is Printed Circuit Board Assembly (PCBA) , PCB Assembly-PCB PCBA assembly-PCBA manufacturer,printed circuit board assembly, it describes the finished board after all the components have been soldered and installed on a printed circuit board (PCB). The conductive pathways engraved in the laminated copper sheets of PCBs are used within a non-conductive substrate in order to form the assembly. Attaching the electronic components to the PCBs is the concluding action to create a fully operational electronic device.
When it comes to BGA assembly, let’s first understand what BGA is. BGAs (Ball Grid Arrays) are a type of IC package where the pins are placed in the form of solder balls. Compared to traditional packaging technologies such as DIP (Dual In-line Package) or QFP (Quad Flat Package), BGA employs a higher-density pin layout.
Now let’s watch the BGA FPGA below to learn more about BGA packaging. PCB Assembly-PCB PCBA assembly-PCBA manufacturer,printed circuit board assembly.
With technological advancements, there is an increasing demand in PCB design for complex and small-sized chips. These chips enable higher integration and functionality within smaller spaces. Hence, there is a need for a packaging method that can accommodate these chips with higher I/O density while maintaining cost-effectiveness. BGA (Ball Grid Array) is precisely such a packaging method that meets these requirements.
What is BGA PCB Assembly?
BGA assembly refers to the process of mounting a Ball Grid Array (BGA) onto a PCB using the reflow soldering technique. BGA is a surface-mounted component that utilizes an array of solder balls for electrical interconnection. As the circuit board passes through a solder reflow oven, these solder balls melt, forming electrical connections. PCB Assembly-PCB PCBA assembly-PCBA manufacturer,printed circuit board assembly
Steps of BGA Assembly
The BGA assembly process typically involves the following steps:
- PCB Preparation: The PCB is prepared by applying solder paste to the pads where the BGA will be mounted. The solder paste is a mixture of solder alloy particles and flux, which helps with the soldering process.
- Placement of BGAs: The BGAs, which consist of the integrated circuit chip with solder balls on the bottom, are placed onto the prepared PCB. This is typically done using automated pick-and-place machines or other assembly equipment.
- Reflow Soldering: The assembled PCB with the placed BGAs is then passed through a reflow oven. The reflow oven heats the PCB to a specific temperature that melts the solder paste, causing the solder balls of the BGAs to reflow and establish electrical connections with the PCB pads.
- Cooling and Inspection: After the solder reflow process, the PCB is cooled down to solidify the solder joints. It is then inspected for any defects, such as misalignment, shorts, or open connections. Automated optical inspection (AOI) or X-ray inspection may be used for this purpose.
- Secondary Processes: Depending on the specific requirements, additional processes such as cleaning, testing, and conformal coating may be performed after BGA assembly to ensure the reliability and quality of the finished product.
- Small footprint
- Robustness
- Lower parasitic inductance and capacitance
- Increased storage space
- High stability
- Good heat dissipation
- Convenient for rework
- Avoidance of wiring chaos
- Plastic BGA (PBGA)
- Ceramic BGA (CBGA)
- Micro BGA
- Micro Fine Line BGA (MBGA)
- Stack BGAs
- Lead BGA and leadless BGA